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第三代
半導(dǎo)體測(cè)試家族
Third generation semiconductor testing family
 
QP2000

Suitable for automatic probe testing of wafers such as 6 and 8″ Si and SiC discrete devices, power devices, integrated circuits, radio frequency devices, optical chips, etc. Automatic loading and unloading, Wafer ID reading. Fully automatic CCD visual needle positioning. High precision positioning platform. Support high temperature testing. Real time generation of Mapping display Bin. Universal GPIB, TTL, R-232 interfaces.



Suspended power supply

Multiple sites in parallel

Multi-channel high precision

Supports multiple extensions

Model QP2000
Product introduction Suitable for automatic probe testing of wafers such as 6 and 8″ Si and SiC discrete devices, power devices, integrated circuits, radio frequency devices, optical chips, etc. Automatic loading and unloading, Wafer ID reading.
Features ? Fully automatic CCD visual needle positioning.
? High-precision positioning platform.
? Support normal high temperature testing.
? Generate Mapping display Bin in real time.
? Universal GPIB, TTL, R-232 interface.


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